1成果简介
2图文导读
图1. Schematic illustration of the fabricating procedure of PW/CPAN@CNT/GA.
图2. a) FTIR spectra of CNTs, PAN@CNT, CPAN@CNT, GO, rGA, PCGA and CPAN@CNT/GA. b, c) C 1s XPS spectra, d) Raman spectra, e) XRD patterns of GO, rGA, PCGA and CPAN@CNT/GA. f) TGA curves of CNTs, PAN@CNT, PAN, GO, rGA, PCGA and CPAN@CNT/GA.
图 3. a-h) SEM images of rGA, CPAN@CNT/GA-1, 2, 3, 4, 5, 6 and 7. i) SEM images of PCGA. j) SEM images of CPAN@CNT/GA. k) EDS mapping images of CPAN@CNT/GA. l-n) TEM images of CPAN@CNT/GA with various magnification.
图4. a) Compressive stress of rGA, CGA, PCGA, CPAN@CNT/GA, PGA and CPGA at 20% and 50% strain. b) Compressive stress of CPAN@CNT/GA with different PAN@CNT content. c) Stress-strain curves of CPAN@CNT/GA with 10 cycles. d) Comparison of compression results with other studies. e) Time-temperature curves of rGA and CPAN@CNT/GA heating on 100°C and 200°C hot plates. f) Thermal conductivity of rGA, PCGA, CPAN@CNT/GA, PW/CPAN@CNT/GA and PW. g) The schematic of the articular structure.
图5. a) FTIR spectra of PW and PW/CPAN@CNT/GA. b) Heating and c) cooling DSC curves of PW, CPAN@CNT/GA and PW/CPAN@CNT/GA. d) Enthalpy and phase change temperatures of PW and PW/CPAN@CNT/GA. e, f) FTIR spectra and DSC curves of PW/CPAN@CNT/GA for 100 cycles. g) Infrared images of PW/CPAN@CNT/GA on a 100 °C hot plate. h) Time-temperature curves of CPAN@CNT/GA, PW/CPAN@CNT/GA and DPGA on a 100 °C hot plate.
图6. a) Schematic diagram of PW/CPAN@CNT/GA in the field of solar-thermal energy conversion. b) Schematic diagram of simulated sunlight exposure. c) Ultraviolet-visible-near-infrared absorption spectra of PW and PW/CPAN@CNT/GA. d) Time-temperature curves of CPAN@CNT/GA, PW and PW/CPAN@CNT/GA under 1 kW m-2 irradiation.
图7. a) Schematic drawing of STEG system. b) Output voltages of the blank, PW and PW/CPAN@CNT/GA-covered thermoelectrics when the heatsink is in the air. c) Output voltages and d) currents of PW/CPAN@CNT/GA-covered thermoelectrics when the heatsink is in the air. e) Steady output electricity of PW/CPAN@CNT/GA. f) STEG uses proof-of-concept experiments to sustain the operation of electronic devices. g) Digital pictures of power generation devices. h) Digital pictures of electrical devices at work.
3小结
文献:
https://doi.org/10.1016/j.carbon.2025.120446
行业“科技创新领跑者”申报中
中国绝热节能材料协会即将举办第九届中国绝热节能材料行业科技创新大会暨“第五届气凝胶材料国际学术研讨会”,同期召开“2025山东省材料大会”和协会七届十六次常务理事会。
时间:2025年7月11日-13日
地点:山东淄博
行业科技创新项目成果,我会将在“第九届中国绝热节能材料行业科技创新大会”暨“第五届气凝胶材料国际学术研讨会”上颁发行业“科技创新领跑者”荣誉证书,并以荣誉榜单形式宣传推介,以期强化企业创新主体地位,激发企业创新发展新质生产力,助推行业高质量发展。
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